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National Repository of Grey Literature 4 records found  Search took 0.01 seconds. 
Applications of Adhesives in Microelectronics Assembly
 Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Detailed record
Applications of Adhesives in Microelectronics Assembly
 Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Detailed record
Applications of Adhesives in Microelectronics Assembly
 Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Detailed record
Applications of Adhesives in Microelectronics Assembly
 Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Detailed record

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